PRODUCTION EQUIPMENT
	
		生产设备
	
					 
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| Laser切割机 | Mason Open-Short测试机 | 裁切机 | 打孔机 | 
					 
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| 黑孔线 | 加热平台 | 双开门烤箱 | 四开门快压机 | 
					 
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| 文字印刷机 | 沃得JH-25型冲床 | 压膜机 | 志圣平行曝光机 | 
					 
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| 钻孔机 | FQC终检车间 | TDR阴抗测试仪 | 参观走道 | 
					 
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| 化学实验室 | 化学清洗和显影蚀刻线 | 飞针测试机 | 二次元测量仪 | 
					 
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| 耐弯曲测试仪 | 耐弯折测试仪 | 湿制程车间 | 物理实验室 | 
					 
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| 推拉力测试仪 | 图技切割机 | 
		TECHNICAL CAPABILITY
	
		技术能力
	
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 PCB研发板生产能力  | 
 PCB批量生产能力  | 
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 数量  | 
 
  | 
 ≤20pcs  | 
 ≥1 sq.m.  | 
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 板类型  | 
 刚性板  | 
 2-36  | 
 2-20  | 
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 柔性板  | 
 Yes  | 
 NA  | 
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 刚柔结合板  | 
 Yes  | 
 NA  | 
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 HDI  | 
 1+6+1,4+N+4  | 
 NA  | 
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 板材类型  | 
 
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						FR4,CEM-1,BT,Polymide,Rogers,  | 
 
						FR4,CEM-1,BT,Polymide,  | 
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 HIGH TG  | 
 TG-170  | 
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 HALOGEN FREE  | 
 HALOGEN FREE  | 
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| 
 
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 HIGH FREQUENCY  | 
 HIGH FREQUENCY  | 
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 最大成品板尺寸  | 
 
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 20*30inch  | 
 20*24nch  | 
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 板厚范围  | 
 
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 0.05-6.0mm  | 
 0.36-4.0mm  | 
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 最小线宽  | 
 
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 3mil  | 
 5mil  | 
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 最小线距  | 
 
  | 
 3mil  | 
 5mil  | 
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 外层最大铜厚  | 
 
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 6OZ  | 
 3oz  | 
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 内层最大铜厚  | 
 
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 5OZ  | 
 3oz  | 
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 最小机械钻孔  | 
 
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 0.20mm  | 
 0.25mm  | 
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 最小激光钻孔  | 
 
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 0.10mm  | 
 NA  | 
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 激光钻孔板厚孔径比  | 
 
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 1.2:1  | 
 1:0.7  | 
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 机械钻孔板厚孔径比  | 
 
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 16:1  | 
 12:1  | 
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 最小孔环  | 
 
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 4mil  | 
 5mil  | 
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 最小阻焊桥宽  | 
 
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 3mil  | 
 4mil  | 
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 最小字符线宽  | 
 
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 4mil  | 
 5mil  | 
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 阻焊颜色  | 
 
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						绿色、蓝色、黄色、紫色、  | 
 
						绿色、蓝色、黄色、紫色、  | 
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 字符颜色  | 
 
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 白色、黄色、黑色  | 
 白色、黄色、黑色  | 
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 阻抗控制公差  | 
 
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 5%  | 
 10%  | 
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 表面工艺  | 
 
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 HASL  | 
 HASL  | 
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 ENIG  | 
 ENIG  | 
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 OSP  | 
 OSP  | 
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 LEAD FREE HASL  | 
 LEAD FREE HASL  | 
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 Plating Gold  | 
 Plating Gold  | 
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 Immersion Ag  | 
 Immersion Ag  | 
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 Immersion Sn  | 
 IMMERSIONSn  | 
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 外形公差  | 
 
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 ±0.10mm  | 
 ±0.15mm  | 
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 板厚公差  | 
 0.21—1.0  | 
 ±0.1  | 
 ±0.1  | 
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 1.0–2.5  | 
 ±7%  | 
 ±10%  | 
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 2.5-6.3  | 
 ±6%  | 
 ±8%  | 
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 孔径公差  | 
 0-0.3  | 
 +0.05mm  | 
 +0.075mm  | 
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 0.31—0.8mm  | 
 ±0.05mm  | 
 ±0.075mm  | 
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 0.81-1.60mm  | 
 ±0.075mm  | 
 ±0.10mm  | 
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 1.61-2.49mm  | 
 ±0.075mm  | 
 ±0.10mm  | 
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 2.5-6.0mm  | 
 +0.15/-0mm  | 
 +0.15/-0mm  | 
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 >6.0mm  | 
 +0.3/-0mm  | 
 +0.3 /-0mm  | 
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 精度指标  | 
 层与层图形重合度  | 
 ±0.12mm  | 
 ±0.12mm  | 
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 图形对孔位精度  | 
 ±0.13mm  | 
 ±0.13mm  | 
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 图形对板边精度  | 
 ±0.15mm  | 
 ±0.15mm  | 
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 孔位与孔位精度  | 
 ±0.13mm  | 
 ±0.13mm  | 
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 孔位对板边精度  | 
 ±0.15mm  | 
 ±0.20mm  | 
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 线宽精度公差  | 
 +\- 0.02mm  | 
 +\-20%  | 
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 项目  | 
 FPC制程能力  | 
 备注  | 
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 常规  | 
 特殊  | 
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 阻抗板  | 
 单端阻抗值:>50Ω公差±10%  | 
 
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 差分阻抗值:≤50Ω 公差±5Ω  | 
 
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						成品外形  | 
 ±0.1mm  | 
 ±0.05mm  | 
 
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 成品最小尺寸  | 
 8*10mm  | 
 
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 FPC板厚  | 
 单面板:0.10-0.13mm  | 
 最小:0.05mm  | 
 
						常规能力以外接单  | 
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 双面板:0.13-0.20mm  | 
 双面板:0.13-0.20mm  | 
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 三层板:0.20-0.25mm  | 
 最小:0.18mm  | 
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 四层板:0.25-0.3mm  | 
 最小:0.20mm  | 
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 FPC板厚公差  | 
 单面板:±0.02mm  | 
 ±0.01mm  | 
 
						超出特殊能力  | 
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 双面板:±0.03mm  | 
 ±0.02mm  | 
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 多层板:±0.05mm  | 
 ±0.03mm  | 
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 金手指区域公差  | 
 ±0.03mm  | 
 ±0.01mm  | 
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 多层板叠构  | 
 三层板:1双+1单  | 
 
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						四层板:1单+1双+1单;  | 
 1双+1双  | 
 
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						线边距至成型边  | 
 0.2mm  | 
 0.1mm  | 
 
						做到0.1mm需要镭射  | 
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 拼版尺寸  | 
 长*宽:250mm*250mm以内  | 
 最大250*610mm  | 
 
						超出特殊能力  | 
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 工艺边尺寸  | 
 单面板:单边≥8mm  | 
 单边≥5mm  | 
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 双面板:单边≥8mm  | 
 单边≥5mm  | 
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 多层板:单边≥12mm  | 
 单边≥10mm  | 
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 钻孔孔径  | 
 0.15-6.35mm  | 
 最小孔径0.1mm  | 
 
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 槽孔孔径  | 
 0.8mm*1.5mm  | 
 0.6mm*1.0mm  | 
 
						0.4-0.6mm槽孔可  | 
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 孔径公差  | 
 PTH孔:±0.075mm  | 
 ±0.05mm  | 
 
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 NPTH孔:±0.05mm  | 
 
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 孔位精度  | 
 一次钻孔:±0.075mm  | 
 ±0.05mm  | 
 
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 二次钻孔:±0.075mm  | 
 
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 孔铜厚度  | 
 双面板:8-15um  | 
 可依据客户要求  | 
 
						超出特殊能力  | 
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 多层板:12-18um  | 
 可依据客户要求  | 
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 孔环RING边  | 
 双面板:0.125mm  | 
 0.1mm  | 
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 多层板外层:≥0.125mm  | 
 0.1mm  | 
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 多层板内层:≥0.15mm  | 
 0.125mm  | 
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 PTH孔环边  | 
 双面板:≥0.1mm  | 
 0.075mm  | 
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						PTH孔环边  | 
 双面板:≥0.1mm  | 
 0.075mm  | 
 
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 多层板外层:≥0.1mm  | 
 0.075mm  | 
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 多层板内层:≥0.125mm  | 
 0.1mm  | 
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 NPTH孔到线距离  | 
 ≥0.25mm  | 
 ≥0.2mm  | 
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 NPTH孔削铜  | 
 ≥0.2mm  | 
 
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 PAD到线路最小距离  | 
 0.2mm  | 
 0.15mm  | 
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 网格尺寸  | 
 0.4mm*0.4mm  | 
 0.2mm*0.2mm  | 
 45°倾斜  | 
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 菲林补偿  | 
 1/3OZ底铜:0.018mm  | 
 0.015-0.02mm  | 
 确保最小线距≥0.045mm  | 
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 1/2OZ底铜:0.025mm  | 
 0.02-0.03mm  | 
 确保最小线距≥0.05mm  | 
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 1OZ 底铜:0.035mmm  | 
 1OZ 底铜:0.035mm  | 
 确保最小线距≥0.065mm  | 
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 确保最小线距≥0.065mm  | 
 0.1-0.02mm  | 
 
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 最小线宽线距  | 
 1/3OZ底铜:0.025mm*0.025mm  | 
 
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 1/2OZ底铜:0.05mm*0.05mm  | 
 
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 1OZ 底铜:0.075mm*0.075mm  | 
 
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 线路对准度  | 
 ±0.075mm  | 
 ±0.05mm  | 
 
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 线路重合度  | 
 ±0.075mm  | 
 ±0.075mm  | 
 
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 蚀刻公差  | 
 蚀刻公差  | 
 
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 覆盖膜开窗最小孔  | 
 钻孔:0.4mm  | 
 
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 钢模:0.6mm  | 
 0.5mm  | 
 
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 切割机:0.7mm  | 
 
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 镭射:不特别限制  | 
 
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 覆盖膜最小 方形开窗  | 
 钻孔:0.7*1.2mm  | 
 0.6mm*1.0mm  | 
 
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 刀模:0.4mm*0.4mm  | 
 
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 钢模:0.5mm*0.5mm  | 
 0.4mm*0.4mm  | 
 
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 切割机:0.7mm*0.7mm  | 
 0.6mm*0.6mm  | 
 安全值以上0.7mm  | 
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 镭射:不特别限制  | 
 
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 覆盖膜最小开窗间距  | 
 钻孔:0.2mm  | 
 
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 钢模:0.5mm  | 
 
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 切割机:0.7mm  | 
 
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 刀模:0.2mm  | 
 
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 镭射:不特别限制  | 
 
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 覆盖膜溢胶量  | 
 ≤0.15mm  | 
 ≤0.1mm  | 
 
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 覆盖膜对准度  | 
 手工:≤0.2mm  | 
 ≤0.15mm  | 
 
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 治具:≤0.1mm  | 
 ≤0.05mm  | 
 
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 印刷精度  | 
 0.2mm  | 
 
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 阻焊最小开窗  | 
 感光0.35mm/UV0.5mm  | 
 
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 阻焊开窗离PAD单边最小距离  | 
 阻焊开窗离PAD单边最小距离  | 
 
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 最小阻焊桥  | 
 感光0.1mm/UV0.25mm  | 
 
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 阻焊最小文字开窗间隙  | 
 0.2mm  | 
 0.15mm  | 
 
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 阻焊厚度  | 
 10-25um  | 
 
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 阻焊菲林对准度  | 
 0.075mm  | 
 0.05mm  | 
 
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 最小字宽  | 
 0.15mm  | 
 0.1mm  | 
 
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 最小字符线条宽度  | 
 ≥0.15mm  | 
 0.1mm  | 
 
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 最小字符线条高度  | 
 ≥0.80mm  | 
 ≥0.80mm  | 
 
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 字符之间最小间距  | 
 0.15mm  | 
 0.1mm  | 
 
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 字符到PAD最小距离  | 
 0.25mm  | 
 0.2mm  | 
 
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 化金及镍厚度  | 
 0.025um-0.075um/1.5-3um  | 
 镍厚最大9um  | 
 
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 电金及镍厚度  | 
 0.075um-0.125um/1.5-3um  | 
 镍厚最大9um  | 
 相对金手指  | 
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 镀锡及厚度  | 
 3-10um  | 
 
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 表面处理可两两选择性进行表工艺处理  | 
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 化锡及厚度  | 
 0.8-1.2um  | 
 
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 OSP及厚度  | 
 0.2-0.4um  | 
 
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 化银及厚度  | 
 0.10-0.3um  | 
 
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 治具架最小探针  | 
 专用:0.15mm  | 
 
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 复合:0.1mm  | 
 
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 最小测试PAD宽  | 
 电测:0.1mm  | 
 
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 飞针:0.075mm  | 
 
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 最小测试PIN宽  | 
 电测:0.1mm  | 
 
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 飞针:0.15mm  | 
 
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 最小测试间距  | 
 电测:0.06mm  | 
 
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 飞针:0.15mm  | 
 
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 直径及公差  | 
 2mm±0.05mm  | 
 
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						产品及补强  | 
 钢模≥0.2mm  | 
 0.15mm  | 
 
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 刀模≥0.2mm  | 
 0.3mm  | 
 
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 镭射≥0.2mm  | 
 0.05mm  | 
 
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						产品及补强  | 
 钢模≤0.1mm  | 
 0.03mm  | 
 
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 刀模≤0.1mm  | 
 0.05mm  | 
 只适应产品  | 
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 镭射≤0.05mm  | 
 0.03mm  | 
 
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		PRODUCTS
	
		产品展示
	
					 
				 | 
					 
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				 | 
| 六层PCB板 | 四层阻抗FPC板 | 四层绿油PCB板 | 四层黑油PCB板 | 
					 
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| 双面阻抗PCB板 | 双面屏蔽膜FPC板 | 双面排线FPC板 | 双面金手指FPC板 | 
					 
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| 双面黄色覆盖膜FPC板 | 双面黑色覆盖膜FPC板 | 双面电源PCB板 | 双面PCB板 | 
					 
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| 双面FPC板 | 三层埋盲孔FPC板 | 六层阻抗PCB板 | 六层PCB板 | 
					 
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| 四层阻抗FPC板 | 四层绿油FPC板 | 四层黑油FPC板 | 双面阻抗PCB板 | 
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				
				

				
				
				
				
					
					
					
					
					
					
					
					
					
					
					
					
					
					
					
					
					





